1/10/2024 0 Comments Reflow solder ovenContact Indium Corporation’s Technical support team to discuss these lower-voiding solder paste options. It should also be pointed out that some solder pastes have been developed to reduce voiding to around 10% without requiring vacuum reflow. To avoid the defect, assure effective under-stencil cleaning and board gasketing. After reflow, this offending solder can look like solder splatter. If the stencil under-wipe process or the board gasketing to the stencil is not adequate, solder can be transmitted to the board in areas where it is not intended to be transferred. In some cases, what people have thought was solder splatter was actually caused by the stencil printing process. Some ovens only have a vacuum chamber in the peak zone and in this case the vacuum should be kept on as long as possible. When possible, keep the vacuum on until after the solder has solidified.The time delay before the vacuum is pulled is to maximize the chances of solvent volatilization in the flux and prevent solder spatter. This parameter is important with some fluxes needing more time and others needing less time. The vacuum should be pulled about 30 seconds after the solder becomes molten.So minimizing the slope will help to reduce solder splatter. If you want to reflow with lead-free solder paste there is the possibility that the thermostat of the oven will shut it down before the temperature you need to reach. The steeper the slope, in going from 1000 to 200 mbar, the more likely to produce splattering. The pressure in the oven will be reduced to about 200 mbar (1 atmosphere is 1000 mbar).Here are some critical recommendations to successfully reduce both voids AND solder splatter: These ovens all but eliminate voiding, however, if not used properly, they can cause solder splatter/splash. In response to this concern, vacuum reflow ovens have emerged. It is not uncommon for more than 40% of the thermal pad area to experience solder voiding after reflow, increasing the risk of over-heating of the BTC in field operation. The tremendous increase in the use of bottom terminated components (BTCs), some estimates are at more than 50 billion per year, have heightened the concern for minimizing voiding between the thermal pad and the BTC. SiP & Heterogeneous Integration & Assembly (HIA) Reflow Solder Oven on sale manufacturers, find details about Reflow Solder Oven manufacturers, supplier and wholesaler - Dongguan Intercontinental Technology Co.,Ltd.The Indium Corporation & Macartney Family Foundation.
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